Thermally Conductive Electrically Insulating Adhesive

3m thermally conductive epoxy adhesive tc 2810 is a thermally conductive 2 part epoxy using boron nitride bn filler for good thermal conductivity with high adhesion.

Thermally conductive electrically insulating adhesive.

The bond ply family of materials are thermally conductive and electrically isolating. Thermal conductive electrically insulative epoxy cures at room temperature. Thermally conductive electrically insulating low thermal expansion adhesive epoxy adhesive thermo bond 110 is flame retardant and is designed to meet the rigid requirement of ul 94 v0. Formulated to draw heat away from sensitive electronic components these potting compounds have higher thermal conductivity than standard potting compounds.

5200 exhibits a high thermal conductivity of 2 5w mk and a low volume resistivity of 0. Thermally conductive electrically insulating low thermal expansion adhesive epoxy adhesive. 50 3170 is a high performance thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. A replacement to screw mounting.

Outstanding heat dissipative properties. Good thermal conductivity 1 0 1 4 w m k low cl ion content and outgassing. Bond ply provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. Technical product bulletin thermally conductive electrically insulating compound product description.

Aa bond 2153 thermally conductive electrically insulating compound 2 part thixtropic. Our aluminum filled system is widely used for the assembly of both fin bonded and folded fin heat sinks as well as cooling plates. A replacement to heat cure adhesives. Flexible low viscosity thermally conductive epoxy.

Rigid and wear resistant epoxies are the strongest of the potting compounds. Use them to encase electronic assemblies for protection from dust chemicals moisture mechanical shock and vibration. Aa bond 2153 is a thixotropic smooth paste thermal conductive epoxy system that passes the nasa outgassing specification. 50 3170 can be used for bonding sensitive components or for potting of power supplies coils glass diodes and other delicate assemblies.

A silver filled electrically conductive low outgassing epoxy appli tec s 5200 is specifically designed to cure with low shrinkage at room temperature or cure quickly at elevated temperatures the material is ideal for applications such as electrical bonding emi shielding and room temperature soldering. Meets nasa low outgassing specifications. Serviceable from 60 f to 250 f. Bond ply is available in a psa or laminating format.